HP BladeSystem Administration (HE646S)


HP BladeSystem Administration (HE646S)

Course Description

This 3-day course provides instruction on HP BladeSystem
administration and management. Discussion of the portfolio
overview ensures an understanding of components,
configurations, and solutions.

Course Duration : 3 days


HP recommends that participants have attained the following
credentials or levels of experience before taking this course:
• Introduction to HP ProLiant Servers (HE643S) or similar experience
is recommended

Course outline

Module 1: HP BladeSystem portfolio introduction

• Identify resources for information about the current HP c-Class
BladeSystem portfolio
• Differentiate the two types of HP BladeSystem enclosures
• Identify HP BladeSystem ProLiant servers
• Identify HP Integrity server blades
• Describe other components in the c-Class portfolio:
-HP BladeSystem adapters and mezzanines
-HP BladeSystem interconnects
-HP BladeSystem c-Class options
• Define the warranty and support options for HP BladeSystem

Module 2: HP BladeSystem c-Class enclosures

• Describe the HP BladeSystem c-Class enclosures
• Describe the c-Class enclosure structure
• Explain c-Class enclosure signal pathing for installing mezzanines
and interconnects in the correct locations
• Define an enclosure numbering scheme
• Explain how to access the HP Onboard Administrator

Module 3: HP BladeSystem power and cooling

• Explain how to configure power for an HP BladeSystem c-Class
• Explain how to control power in a c-Class enclosure
• Describe HP intelligent location and power discovery services
• Describe the structural cooling components and features

Module 4: HP BladeSystem c-Class servers

• Identify the distinctions between the HP ProLiant G7 and Gen8
• Describe the technologies on the ProLiant system board:
-USB and SD cards
-Embedded LOM and FlexibleLOM
• Identify c-Class Integrity servers and their requirements

Module 5: HP BladeSystem c-Class storage, tape, and
expansion blades
• Describe how the HP BladeSystem c-Class enclosure architecture
enables partnering of server blades with storage or expansion
• Explain the placement rules and installation guidelines for storage
and expansion blades
• Describe the features and components of:
-Storage blades
-Tape blades
-Expansion blades

Module 6: HP BladeSystem c-Class connectivity options

• Describe the HP BladeSystem c-Class interconnect module
• List the BladeSystem c-Class interconnect modules:
-Fibre Channel
• Describe the mezzanine cards and slots available in the
BladeSystem c-Class server blades
• Describe HP BladeSystem c7000 and c3000 enclosure port

Module 7: HP Virtual Connect overview

• Define the benefits of HP BladeSystem solutions with HP Virtual
Connect technology
• Describe Virtual Connect technology and its main components
• Identify ways to use Virtual Connect technology in a data center
• Describe the VC Flex technology
• Describe the VC FlexFabric Fibre Channel storage with 3PAR

Module 8: HP BladeSystem c7000 enclosure and infrastructure
installation and management

• List the steps for planning an HP BladeSystem c7000 enclosure
• Explain the process for installing the c7000 enclosure components
• List the initial steps involved in setting up the c7000 enclosure
using the:
-HP Insight Display Initial Setup Wizard
-HP Onboard Administrator (OA) First Time Setup Wizard
• Describe the OA management features
• Describe the HP BladeSystem c-Class enclosure power and thermal

Module 9: HP BladeSystem c-Class firmware

• Determine what firmware is embedded in various components in
the enclosure and how to update it
• Explain how to access the HP SPP download and documentation
• Describe how to update firmware for the HP OA using:
• Explain how to implement HP BladeSystem c-Class enclosure
• Explain how to update firmware embedded in the OA for a blade